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English
English
GermanSawn Wafer series
Supporting Manufacturer Information
- Merit Sensor Application Note (AN101)
- Merit Sensor Application Note (AN102)
- Merit Sensor Application Note (AN103)
- Merit Sensor Application Note (AN104)
- Merit Sensor Application Note (AN105)
- Merit Sensor CA Proposition 65 Declaration
- Merit Sensor Case Study for BP Series Blood Pressure Sensor
- Merit Sensor Case Study for Medical systems including inflation devices
- Merit Sensor Case Study for Tier 1 automotive supplier pressure transducers
- Merit Sensor Conflict Minerals Policy
- Merit Sensor Product Selection Guide
- Merit Sensor REACH Compliance
- Merit Sensor RoHS Compliance (MEMs Silicon Die)
- Merit Sensor RoHS Compliance (Pressure Sensor Packages)
- Merit Sensor RoHS Compliance (TR & TVC Series)
- Harsh media low and medium pressure MEMS sensing element
- Suitable for air, gases and liquids that are compatible with silicon and glass
- Bridge options of closed or closed with temperature diode available
- Parts supplied as sawn wafer on tape in metal frame or die in waffle pack
